{"id":2442,"date":"2021-04-17T08:36:24","date_gmt":"2021-04-17T08:36:24","guid":{"rendered":"https:\/\/rd-electronic.com\/2021\/04\/manufacturing-of-electronic-assemblies\/"},"modified":"2021-04-26T16:48:38","modified_gmt":"2021-04-26T14:48:38","slug":"manufacturing-of-electronic-assemblies","status":"publish","type":"post","link":"https:\/\/rd-electronic.com\/en\/2021\/04\/manufacturing-of-electronic-assemblies\/","title":{"rendered":"Man\u00adu\u00adfac\u00adtur\u00ading of elec\u00adtron\u00adic assemblies"},"content":{"rendered":"\n<h2 class=\"wp-block-heading\">Sequence of a typ\u00adi\u00adcal assem\u00adbly production<\/h2>\n\n<p>The pro\u00adduc\u00adtion or the Elec\u00adtron\u00adics Man\u00adu\u00adfac\u00adtur\u00ading Ser\u00advice (EMS) of a print\u00aded cir\u00adcuit board to be assem\u00adbled can be divid\u00aded into the fol\u00adlow\u00ading work&nbsp;steps:<\/p>\n\n<ol class=\"wp-block-list\"><li>Pro\u00adduc\u00adtion of the print\u00aded cir\u00adcuit board (PCB)<\/li><li>Depo\u00adsi\u00adtion of sol\u00adder paste on the future con\u00adtact points of the com\u00adpo\u00adnents. The high\u00adly vis\u00adcous sol\u00adder paste con\u00adsists of tiny tin balls and&nbsp;flux.<\/li><li>Assem\u00adbly of the print\u00aded cir\u00adcuit board. SMD com\u00adpo\u00adnents (SMD, Sur\u00adface Mount\u00aded Devices) are now placed in the sol\u00adder paste depots. They ini\u00adtial\u00adly adhere there only through the adhe\u00adsive effect of the sol\u00adder paste. The assem\u00adbly process is automated.<\/li><li>Sol\u00adder\u00ading the SMD com\u00adpo\u00adnents. The sol\u00adder paste melts under the influ\u00adence of heat and firm\u00adly bonds the SMD com\u00adpo\u00adnents to the cir\u00adcuit&nbsp;board.<\/li><li>Assem\u00adbly of the print\u00aded cir\u00adcuit board with con\u00adven\u00adtion\u00adal, wired com\u00adpo\u00adnents using THT tech\u00adnol\u00ado\u00adgy (THT, Through Hole Tech\u00adnol\u00ado\u00adgy). This is done by insert\u00ading the con\u00adnec\u00adtion wires into the holes made for this pur\u00adpose in the cir\u00adcuit&nbsp;board.<\/li><li>Sol\u00adder\u00ading of the THT com\u00adpo\u00adnents. The sol\u00adder\u00ading is prefer\u00adably done with a robot, but can also be done manually.<\/li><li>Inspec\u00adtion of the assem\u00adbly result, visu\u00adal\u00adly and elec\u00adtri\u00adcal\u00adly by spe\u00adcif\u00adic mea\u00adsure\u00adment tech\u00adnol\u00ado\u00adgy. For com\u00adplex assem\u00adblies or series prod\u00aducts, pre\u00adcise\u00adly designed test sys\u00adtems are designed.<\/li><\/ol>\n<h3 class=\"wp-block-heading\">Appli\u00adca\u00adtion of sol\u00adder&nbsp;paste<\/h3>\n\n<p>Paste print\u00ading can be done in dif\u00adfer\u00adent ways. Most\u00adly screen print\u00ading or sten\u00adcil print\u00ading is used. Both process\u00ades have in com\u00admon that where an open\u00ading has been cut in a stain\u00adless steel mesh or sheet with a high-pre\u00adci\u00adsion laser, the sol\u00adder paste can wet the PCB. Each cir\u00adcuit board lay\u00adout there\u00adfore requires a spe\u00adcial\u00adly man\u00adu\u00adfac\u00adtured screen or sten\u00adcil. The pastes used are pre\u00adcise\u00adly matched to the mesh count of the screen or to the stain\u00adless steel sten\u00adcil. The qual\u00adi\u00adty of the print is checked by visu\u00adal inspection.<\/p>\n\n<h3 class=\"wp-block-heading\">Assem\u00adbly of the print\u00aded cir\u00adcuit&nbsp;board<\/h3>\n\n<p>The com\u00adpo\u00adnents are set up on rolls, belts, trays or in bars on the pick-and-place machine. The com\u00adpo\u00adnents are removed from the respec\u00adtive pack\u00adag\u00ading by the head of the machine by means of a vac\u00adu\u00adum, cen\u00adtered and aligned in the machine and then assem\u00adbled to the cor\u00adrect X\/Y coor\u00addi\u00adnate of the print\u00aded cir\u00adcuit board. This place\u00adment process is called \u201cpick-and-place\u201d.<\/p>\n\n<h3 class=\"wp-block-heading\">Sol\u00adder\u00ading of the components<\/h3>\n\n<p>For auto\u00admat\u00adic sol\u00adder\u00ading of the assem\u00adblies, we pre\u00adfer to use vapor phase sol\u00adder\u00ading, which is par\u00adtic\u00adu\u00adlar\u00adly gen\u00adtle on com\u00adpo\u00adnents. Here, the heat\u00ading of the print\u00aded cir\u00adcuit board is achieved by the con\u00adden\u00adsa\u00adtion heat of a steam (Galden, LS230). The max\u00adi\u00admum tem\u00adper\u00ada\u00adture that the assem\u00adbly can reach with this sol\u00adder\u00ading process is lim\u00adit\u00aded to 230\u00b0C. The ener\u00adgy require\u00adment for the assem\u00adbly is auto\u00admat\u00adi\u00adcal\u00adly con\u00adtrolled by the sol\u00adder\u00ading time. Dur\u00ading sol\u00adder\u00ading, the sol\u00adder paste melts, makes the elec\u00adtri\u00adcal con\u00adnec\u00adtion and the flux evap\u00ado\u00adrates. After the assem\u00adbly has cooled and dried, the SMD com\u00adpo\u00adnents are per\u00adma\u00adnent\u00adly and elec\u00adtri\u00adcal\u00adly con\u00adnect\u00aded to the&nbsp;PCB.<\/p>\n\n<p>THT com\u00adpo\u00adnents are sol\u00addered man\u00adu\u00adal\u00adly using a sol\u00adder\u00ading iron or auto\u00admat\u00adi\u00adcal\u00adly using a sol\u00adder\u00ading robot. This robot repro\u00adduces the man\u00adu\u00adal sol\u00adder\u00ading process by machine and thus achieves very repro\u00adducible results. Man\u00adu\u00adal work is lim\u00adit\u00aded to han\u00addling the assem\u00adbly and thread\u00ading THT components.<\/p>\n\n<h3 class=\"wp-block-heading\">Check\u00ading the placement\/assembly result<\/h3>\n\n<p>Sol\u00adder\u00ading is not the end of the assem\u00adbly process. In order to con\u00adfirm the qual\u00adi\u00adty pro\u00adduced or to detect defects at an ear\u00adly stage, an AOI (Auto\u00admat\u00adic Opti\u00adcal Inspec\u00adtion) check can be car\u00adried out. Here, an AOI sys\u00adtem uses sev\u00ader\u00adal cam\u00adera sys\u00adtems to auto\u00admat\u00adi\u00adcal\u00adly inspect the print\u00aded cir\u00adcuit board and com\u00adpares the result with a ref\u00ader\u00adence that has been rat\u00aded as good. If there are any devi\u00ada\u00adtions, the oper\u00ada\u00adtor is informed about the exact defect pat\u00adtern, who then cor\u00adrects the defect or rejects the PCB.<br>Much more impor\u00adtant, how\u00adev\u00ader, is the elec\u00adtri\u00adcal test of the man\u00adu\u00adfac\u00adtured assem\u00adbly. For this pur\u00adpose, the assem\u00adbly is con\u00adnect\u00aded to spe\u00adcif\u00adic test equip\u00adment and usu\u00adal\u00adly test\u00aded automatically.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>In this arti\u00adcle you will find an overview of how the basic process works.<\/p>\n","protected":false},"author":4,"featured_media":3181,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"inline_featured_image":false,"wp_typography_post_enhancements_disabled":false,"footnotes":""},"categories":[90],"tags":[],"class_list":["post-2442","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-ems-electronic-assemblies-manufacturing","entry"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Manufacturing of electronic assemblies - Intelligent data flow &amp; processing<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/rd-electronic.com\/en\/2021\/04\/manufacturing-of-electronic-assemblies\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Manufacturing of electronic assemblies - Intelligent data flow &amp; 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